Job description:
We're looking for a hands-on Physical Design Engineer to support complex SoC projects for our client who designs and delivers advanced System-on-Chip solutions across multiple emerging technologies. They provide high-performance custom solutions for cutting-edge applications. You'll collaborate with customers, frontend, and integration teams to ensure successful tape-outs, contributing across all phases of physical design. Profile of preferred candidate includes 10 + years of hands-on experience, custom ASIC, strong communication skills, experience with multiple tape outs from inception, small company experience. Local candidates are preferred.
Key Responsibilities:
- Pre-layout STA for feasibility and timing constraint validation
- Chip/block-level floorplanning and pin assignment
- Clock spec review and clock tree synthesis
- Placement, routing, and timing optimization
- Sign-off tasks: RC extraction, STA, IR-drop analysis, and physical verification
- Customer meetings and technical presentations
Qualifications:
- BSEE with 5+ years experience; MSEE preferred
- Strong experience in ASIC physical design and SoC development (28nm/16nm)
- Proficient in ICC2/Innovus, scripting (Perl/Tcl/Python)
- Knowledge of frontend design and hierarchical layouts
- Familiar with power/IR-drop tools (PrimePower/Redhawk) and STA (PrimeTime)
- Skilled in PV tools and debugging PV errors
- Excellent communication and problem-solving skills
Why is This a Great Opportunity:
Leading custom ASIC and SoC development company with a pipeline of new technology projects for top companies. Employees are real contributors, often working independently or as part of a small team. Will work of full project lifecycle from inception to tapeout.
Salary Type : Annual Salary
Salary Min : $ 170000
Salary Max : $ 220000
Currency Type : USD